HiSilicon Kirin 970
Qualcomm Snapdragon Microsoft SQ2
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HiSilicon Kirin 970 vs Qualcomm Snapdragon Microsoft SQ2

Overall score
star star star star star
Released
Q3/2017
Released
Q3/2020
Overall score
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Which one of the central processing units is better: HiSilicon Kirin 970 or Qualcomm Snapdragon Microsoft SQ2? On this page we compare the technical data and benchmark results of different CPUs.

The HiSilicon Kirin 970 has 8 cores and 8 threads with maximum working frequency of 2.40 GHz. The HiSilicon Kirin 970 was released on Q3/2017.

The Qualcomm Snapdragon Microsoft SQ2 has cores with 8 threads and 2.40 GHz of frequency. The Qualcomm Snapdragon Microsoft SQ2 was released on Q3/2020.

Differences
Reasons to consider
HiSilicon Kirin 970
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Reasons to consider
Qualcomm Snapdragon Microsoft SQ2
Report a bug
Specifications
Complete list of technical specifications
HiSilicon Kirin 970 HiSilicon Kirin 970
Qualcomm Snapdragon Microsoft SQ2 Qualcomm Snapdragon Microsoft SQ2
CPU generation and family

Let's find out which one of HiSilicon Kirin 970 and Qualcomm Snapdragon Microsoft SQ2 is of a more recent generation, and what segment it belongs to.

  • Name
    HiSilicon Kirin 970 left arrow Qualcomm Snapdragon Microsoft SQ2
  • Segment
    Mobile left arrow Mobile
  • Family
    HiSilicon Kirin left arrow Qualcomm Snapdragon
  • Generation
    6 left arrow 1
  • CPU group
    HiSilicon Kirin 970 left arrow Qualcomm Snapdragon SQ1/SQ2
CPU Cores and Base Frequency

In this block we are going to compare HiSilicon Kirin 970 vs Qualcomm Snapdragon Microsoft SQ2 by main technical specifications: number of cores and threads, base and maximum frequencies, process technology and cache size. The higher these specifications are, the more powerful your CPU will be.

  • Overclocking
    No left arrow No
  • Core architecture
    hybrid (big.LITTLE) left arrow hybrid (big.LITTLE)
Internal Graphics

Common specifications for integrated graphics cards in HiSilicon Kirin 970 and Qualcomm Snapdragon Microsoft SQ2 along with supported interfaces and connection options. This block has no effect on the final efficiency of the CPU.

  • GPU name
    ARM Mali-G72 MP12 left arrow Qualcomm Adreno 690
  • GPU frequency
    0.75 GHz left arrow
  • GPU (Turbo)
    No turbo left arrow No turbo
  • Execution units
    12 left arrow 0
  • Shader
    192 left arrow 0
  • Max. GPU Memory
    2 GB left arrow --
  • Max. displays
    1 left arrow 0
  • Generation
    Bifrost 2 left arrow 6
  • Technology
    16 nm left arrow 7 nm
  • Release date
    Q3/2017 left arrow Q2/2020
Hardware codec support

Let's compare the support of video codecs between HiSilicon Kirin 970 and Qualcomm Snapdragon Microsoft SQ2. Hardware support of video decoding by embedded graphics cards directly affects the speed and quality of rendering videos.

  • h265 / HEVC (8 bit)
    Decode / Encode left arrow Decode / Encode
  • h265 / HEVC (10 bit)
    Decode / Encode left arrow Decode / Encode
  • h264
    Decode / Encode left arrow Decode / Encode
  • VP9
    Decode / Encode left arrow Decode
  • VP8
    Decode / Encode left arrow Decode / Encode
  • AV1
    No left arrow No
  • AVC
    Decode / Encode left arrow Decode
  • VC-1
    Decode / Encode left arrow Decode
  • JPEG
    Decode / Encode left arrow Decode / Encode
Memory & PCIe

To choose the best model between HiSilicon Kirin 970 and Qualcomm Snapdragon Microsoft SQ2 you need to pay special attention to memory type, clock frequency, multi-channel features, and PCIe version. The higher these numbers are, the better your CPU will be. Keep in mind that the maximum memory and frequency may also depend on the model of the motherboard.

  • Memory type
    LPDDR4X-2133 left arrow LPDDR4X-2133
  • Max. Memory
    8 GB left arrow 16 GB
  • ECC
    No left arrow No
  • Memory channels
    4 left arrow 8 (Octa Channel)
Thermal Management

Let's find out what TDP value would be better for HiSilicon Kirin 970 or Qualcomm Snapdragon Microsoft SQ2? The Thermal Design Power (TDP) indicates the maximum amount of heat that should be dissipated by the chip cooling system. However, the value of TDP gives only a rough indication of the real power consumption of the CPU.

Technical details

Here you can find a comparison of 2nd and 3rd level cache sizes for HiSilicon Kirin 970 and Qualcomm Snapdragon Microsoft SQ2 CPUs along with a list of ISA extensions.

  • Instruction set (ISA)
    ARMv8-A64 (64 bit) left arrow ARMv8-A64 (64 bit)
  • Virtualization
    None left arrow None
  • L3-Cache
    2.00 MB left arrow --
  • Architecture
    Cortex-A73 / Cortex-A53 left arrow Kryo 495
  • Technology
    10 nm left arrow 7 nm
  • Socket
    N/A left arrow N/A
  • Release date
    Q3/2017 left arrow Q3/2020
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