Qualcomm Snapdragon 7c vs HiSilicon Kirin 810

Let's find out which one of HiSilicon Kirin 810 and Qualcomm Snapdragon 7c is of a more recent generation, and what segment it belongs to.

• Name
  HiSilicon Kirin 810 Qualcomm Snapdragon 7c
• Segment
  Mobile Mobile
• Family
  HiSilicon Kirin Qualcomm Snapdragon
• Generation
  6 2
• CPU group
  HiSilicon Kirin 810/820 Qualcomm Snapdragon 7c
• Successor
  -- Qualcomm Snapdragon 7c Gen 2

In this block we are going to compare HiSilicon Kirin 810 vs Qualcomm Snapdragon 7c by main technical specifications: number of cores and threads, base and maximum frequencies, process technology and cache size. The higher these specifications are, the more powerful your CPU will be.

• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)

Common specifications for integrated graphics cards in HiSilicon Kirin 810 and Qualcomm Snapdragon 7c along with supported interfaces and connection options. This block has no effect on the final efficiency of the CPU.

• GPU name
  ARM Mali-G52 MP6 Qualcomm Adreno 618
• GPU frequency
  0.85 GHz 0.70 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  16 0
• Shader
  288 128
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• Generation
  Bifrost 2 6
• Technology
  12 nm 14 nm
• Release date
  Q1/2018 Q2/2019

Let's compare the support of video codecs between HiSilicon Kirin 810 and Qualcomm Snapdragon 7c. Hardware support of video decoding by embedded graphics cards directly affects the speed and quality of rendering videos.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  No No
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

To choose the best model between HiSilicon Kirin 810 and Qualcomm Snapdragon 7c you need to pay special attention to memory type, clock frequency, multi-channel features, and PCIe version. The higher these numbers are, the better your CPU will be. Keep in mind that the maximum memory and frequency may also depend on the model of the motherboard.

• Memory type
  LPDDR4X-2133 LPDDR4X-2133
• Max. Memory
  6 GB
• ECC
  No No
• Memory channels
  4 2 (Dual Channel)

Let's find out what TDP value would be better for HiSilicon Kirin 810 or Qualcomm Snapdragon 7c? The Thermal Design Power (TDP) indicates the maximum amount of heat that should be dissipated by the chip cooling system. However, the value of TDP gives only a rough indication of the real power consumption of the CPU.

Here you can find a comparison of 2nd and 3rd level cache sizes for HiSilicon Kirin 810 and Qualcomm Snapdragon 7c CPUs along with a list of ISA extensions.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• L3-Cache
  1.00 MB --
• Architecture
  Cortex-A76 / Cortex-A55 Kryo 468
• Technology
  7 nm 8 nm
• Socket
  N/A N/A
• Release date
  Q2/2019 2020
• Part Number
  -- SC7180