Information about the HiSilicon Kirin 810 segment (for desktops or laptops) and the CPU family, along with the sales starting date.

• Name
  HiSilicon Kirin 810
• Segment
  Mobile
• Family
  HiSilicon Kirin
• Generation
  6
• CPU group
  HiSilicon Kirin 810/820

Technical and quantitative specifications of the HiSilicon Kirin 810: number of cores and threads, base and maximum frequencies. The higher these specifications are, the more powerful your CPU will be.

• Frequency
  1.90 GHz
• CPU Cores
  8
• Turbo (1 Core)
  2.20 GHz
• CPU Threads
  8
• Turbo (8 Cores)
  2.20 GHz
• Hyperthreading
  No
• Overclocking
  No
• Core architecture
  hybrid (big.LITTLE)
• A core
  2x Cortex-A76
• B core
  6x Cortex-A55

Common specifications for the integrated graphics card in HiSilicon Kirin 810 along with supported interfaces and connection options. This block has no effect on the final efficiency of the CPU.

• GPU name
  ARM Mali-G52 MP6
• GPU frequency
  0.85 GHz
• GPU (Turbo)
  No turbo
• Execution units
  16
• Shader
  288
• Max. GPU Memory
  4 GB
• Max. displays
  2
• Generation
  Bifrost 2
• DirectX Version
  12
• Technology
  12 nm
• Release date
  Q1/2018

List of video codecs supported by the HiSilicon Kirin 810 CPU. Hardware support of video decoding by embedded graphics cards directly affects the speed and quality of rendering videos.

• h265 / HEVC (8 bit)
  Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode
• h264
  Decode / Encode
• VP9
  Decode / Encode
• VP8
  Decode / Encode
• AV1
  No
• AVC
  Decode / Encode
• VC-1
  Decode / Encode
• JPEG
  Decode / Encode

Memory type, clock frequency, multi-channel features, and PCIe version of the HiSilicon Kirin 810. The higher these numbers are, the better your CPU will be. Keep in mind that the maximum memory and frequency may also depend on the model of the motherboard.

• Memory type
  LPDDR4X-2133
• Max. Memory
  6 GB
• ECC
  No
• Memory channels
  4

Support for AES-NI encryption on the HiSilicon Kirin 810 CPU.

• AES-NI
  No

Let's find out what TDP has the HiSilicon Kirin 810? The Thermal Design Power (TDP) indicates the maximum amount of heat that should be dissipated by the chip cooling system. However, the value of TDP gives only a rough indication of the real power consumption of the CPU.

• TDP (PL1)
  5 W

Here you can find a comparison of 2nd and 3rd level cache sizes for the HiSilicon Kirin 810 CPU along with a list of ISA extensions.

• Instruction set (ISA)
  ARMv8-A64 (64 bit)
• Virtualization
  None
• L3-Cache
  1.00 MB
• Architecture
  Cortex-A76 / Cortex-A55
• Technology
  7 nm
• Socket
  N/A
• Release date
  Q2/2019

List of devices based on HiSilicon Kirin 810.

• Used in
  Huawei Honor 9X ProHuawei Honor Play 4T ProHuawei MatePad 10.4Huawei Nova 5i ProHuawei P40 Lite