Information about the HiSilicon Kirin 9000 segment (for desktops or laptops) and the CPU family, along with the sales starting date.

• Name
  HiSilicon Kirin 9000
• Segment
  Mobile
• Family
  HiSilicon Kirin
• Generation
  9
• CPU group
  HiSilicon Kirin 9000

Technical and quantitative specifications of the HiSilicon Kirin 9000: number of cores and threads, base and maximum frequencies. The higher these specifications are, the more powerful your CPU will be.

• Frequency
  2.05 GHz
• CPU Cores
  8
• Turbo (1 Core)
  3.13 GHz
• CPU Threads
  8
• Turbo (8 Cores)
  2.54 GHz
• Hyperthreading
  No
• Overclocking
  No
• Core architecture
  hybrid (Prime / big.LITTLE)
• A core
  1x Cortex-A77
• B core
  3x Cortex-A77
• C core
  4x Cortex-A55

Common specifications for the integrated graphics card in HiSilicon Kirin 9000 along with supported interfaces and connection options. This block has no effect on the final efficiency of the CPU.

• GPU name
  ARM Mali-G78 MP24
• GPU frequency
  0.76 GHz
• GPU (Turbo)
  No turbo
• Execution units
  24
• Shader
  384
• Max. displays
  1
• Generation
  Vallhall 2
• DirectX Version
  12
• Technology
  5 nm
• Release date
  Q4/2020

List of video codecs supported by the HiSilicon Kirin 9000 CPU. Hardware support of video decoding by embedded graphics cards directly affects the speed and quality of rendering videos.

• h265 / HEVC (8 bit)
  Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode
• h264
  Decode / Encode
• VP9
  Decode / Encode
• VP8
  Decode / Encode
• AV1
  Decode
• AVC
  Decode / Encode
• VC-1
  Decode / Encode
• JPEG
  Decode / Encode

Memory type, clock frequency, multi-channel features, and PCIe version of the HiSilicon Kirin 9000. The higher these numbers are, the better your CPU will be. Keep in mind that the maximum memory and frequency may also depend on the model of the motherboard.

• Memory type
  LPDDR4X-2133LPDDR5-2750
• ECC
  No
• Memory channels
  4

Support for AES-NI encryption on the HiSilicon Kirin 9000 CPU.

• AES-NI
  No

Let's find out what TDP has the HiSilicon Kirin 9000? The Thermal Design Power (TDP) indicates the maximum amount of heat that should be dissipated by the chip cooling system. However, the value of TDP gives only a rough indication of the real power consumption of the CPU.

Here you can find a comparison of 2nd and 3rd level cache sizes for the HiSilicon Kirin 9000 CPU along with a list of ISA extensions.

• Instruction set (ISA)
  ARMv8-A64 (64 bit)
• Virtualization
  None
• Architecture
  Cortex-A77 / Cortex-A55
• Technology
  5 nm
• Socket
  N/A
• Release date
  Q4/2020

List of devices based on HiSilicon Kirin 9000.

• Used in
  Unknown