HiSilicon Kirin 960
Qualcomm Snapdragon 650
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HiSilicon Kirin 960 vs Qualcomm Snapdragon 650

Overall score
star star star star star
Released
Q4/2016
Released
Q1/2016
Overall score
star star star star star

Which one of the central processing units is better: HiSilicon Kirin 960 or Qualcomm Snapdragon 650? On this page we compare the technical data and benchmark results of different CPUs.

The HiSilicon Kirin 960 has 8 cores and 8 threads with maximum working frequency of 2.40 GHz. The HiSilicon Kirin 960 was released on Q4/2016.

The Qualcomm Snapdragon 650 has 6 cores with 8 threads and 2.40 GHz of frequency. The Qualcomm Snapdragon 650 was released on Q1/2016.

Differences
Reasons to consider
HiSilicon Kirin 960
Report a bug
  • Higher clock speed
    1.80 GHz left arrow 1.40 GHz
    Around -29% better clock speed
  • More number of cores
    8 left arrow 6
    2 times more threads
  • Higher turbo clock speed
    2.40 GHz left arrow 1.80 GHz
    Around 25% better overclocked clock speed
Reasons to consider
Qualcomm Snapdragon 650
Report a bug
Specifications
Complete list of technical specifications
HiSilicon Kirin 960 HiSilicon Kirin 960
Qualcomm Snapdragon 650 Qualcomm Snapdragon 650
CPU generation and family

Let's find out which one of HiSilicon Kirin 960 and Qualcomm Snapdragon 650 is of a more recent generation, and what segment it belongs to.

  • Name
    HiSilicon Kirin 960 left arrow Qualcomm Snapdragon 650
  • Segment
    Mobile left arrow Mobile
  • Family
    HiSilicon Kirin left arrow Qualcomm Snapdragon
  • Generation
    5 left arrow 4
  • CPU group
    HiSilicon Kirin 960 left arrow Qualcomm Snapdragon 650
CPU Cores and Base Frequency

In this block we are going to compare HiSilicon Kirin 960 vs Qualcomm Snapdragon 650 by main technical specifications: number of cores and threads, base and maximum frequencies, process technology and cache size. The higher these specifications are, the more powerful your CPU will be.

  • Frequency
    1.80 GHz left arrow 1.40 GHz
  • CPU Cores
    8 left arrow 6
  • Turbo (1 Core)
    2.40 GHz left arrow 1.80 GHz
  • CPU Threads
    8 left arrow 6
  • Hyperthreading
    No left arrow No
  • Overclocking
    No left arrow No
  • Core architecture
    hybrid (big.LITTLE) left arrow hybrid (big.LITTLE)
  • A core
    4x Cortex-A73 left arrow 2x Cortex-A72
  • B core
    4x Cortex-A53 left arrow 4x Cortex-A53
Internal Graphics

Common specifications for integrated graphics cards in HiSilicon Kirin 960 and Qualcomm Snapdragon 650 along with supported interfaces and connection options. This block has no effect on the final efficiency of the CPU.

  • GPU name
    ARM Mali-G71 MP8 left arrow Qualcomm Adreno 510
  • GPU frequency
    0.90 GHz left arrow 0.60 GHz
  • GPU (Turbo)
    No turbo left arrow 0.60 GHz
  • Execution units
    8 left arrow 0
  • Shader
    256 left arrow 128
  • Max. GPU Memory
    2 GB left arrow --
  • Max. displays
    2 left arrow 0
  • Generation
    Bifrost 1 left arrow 5
  • DirectX Version
    11 left arrow 11
  • Technology
    16 nm left arrow 14 nm
  • Release date
    Q2/2016 left arrow Q4/2015
Hardware codec support

Let's compare the support of video codecs between HiSilicon Kirin 960 and Qualcomm Snapdragon 650. Hardware support of video decoding by embedded graphics cards directly affects the speed and quality of rendering videos.

  • h265 / HEVC (8 bit)
    Decode / Encode left arrow Decode
  • h265 / HEVC (10 bit)
    Decode left arrow No
  • h264
    Decode / Encode left arrow Decode
  • VP9
    No left arrow Decode
  • VP8
    Decode / Encode left arrow Decode
  • AV1
    No left arrow No
  • AVC
    Decode / Encode left arrow No
  • VC-1
    No left arrow Decode
  • JPEG
    Decode / Encode left arrow Decode
Memory & PCIe

To choose the best model between HiSilicon Kirin 960 and Qualcomm Snapdragon 650 you need to pay special attention to memory type, clock frequency, multi-channel features, and PCIe version. The higher these numbers are, the better your CPU will be. Keep in mind that the maximum memory and frequency may also depend on the model of the motherboard.

  • Memory type
    LPDDR4-1600 left arrow LPDDR3-933
  • Max. Memory
    6 GB left arrow
  • ECC
    No left arrow No
  • Memory channels
    2 left arrow 2
Encryption

AES-NI encryption support for CPUs HiSilicon Kirin 960 and Qualcomm Snapdragon 650.

  • AES-NI
    No left arrow No
Thermal Management

Let's find out what TDP value would be better for HiSilicon Kirin 960 or Qualcomm Snapdragon 650? The Thermal Design Power (TDP) indicates the maximum amount of heat that should be dissipated by the chip cooling system. However, the value of TDP gives only a rough indication of the real power consumption of the CPU.

  • TDP (PL1)
    5 W left arrow
Technical details

Here you can find a comparison of 2nd and 3rd level cache sizes for HiSilicon Kirin 960 and Qualcomm Snapdragon 650 CPUs along with a list of ISA extensions.

  • Instruction set (ISA)
    ARMv8-A64 (64 bit) left arrow ARMv8-A64 (64 bit)
  • Virtualization
    None left arrow None
  • L3-Cache
    4.00 MB left arrow --
  • Architecture
    Cortex-A73 / Cortex-A53 left arrow Cortex-A72 / Cortex-A53
  • Technology
    16 nm left arrow 28 nm
  • Socket
    N/A left arrow N/A
  • Release date
    Q4/2016 left arrow Q1/2016
  • Part Number
    -- left arrow MSM8956
Devices using this processor

List of devices based on HiSilicon Kirin 960 and Qualcomm Snapdragon 650.

  • Used in
    Huawei Honor 8 ProHuawei Honor 9Huawei Mate 9Huawei Mate 9 ProHuawei Mate 9 PorscheHuawei MediaPad M5Huawei Nova 2sHuawei P10 left arrow Unknown
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