HiSilicon Kirin 650
HiSilicon Kirin 655
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HiSilicon Kirin 650 vs HiSilicon Kirin 655

Overall score
star star star star star
Released
Q2/2016
Released
Q2/2016
Overall score
star star star star star

Which one of the central processing units is better: HiSilicon Kirin 650 or HiSilicon Kirin 655? On this page we compare the technical data and benchmark results of different CPUs.

The HiSilicon Kirin 650 has 8 cores and 8 threads with maximum working frequency of 2.00 GHz. The HiSilicon Kirin 650 was released on Q2/2016.

The HiSilicon Kirin 655 has 8 cores with 8 threads and 2.00 GHz of frequency. The HiSilicon Kirin 655 was released on Q2/2016.

Differences
Reasons to consider
HiSilicon Kirin 650
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Reasons to consider
HiSilicon Kirin 655
Report a bug
  • Higher turbo clock speed
    2.12 GHz left arrow 2.00 GHz
    Around 6 % better overclocked clock speed
Specifications
Complete list of technical specifications
HiSilicon Kirin 650 HiSilicon Kirin 650
HiSilicon Kirin 655 HiSilicon Kirin 655
CPU generation and family

Let's find out which one of HiSilicon Kirin 650 and HiSilicon Kirin 655 is of a more recent generation, and what segment it belongs to.

  • Name
    HiSilicon Kirin 650 left arrow HiSilicon Kirin 655
  • Segment
    Mobile left arrow Mobile
  • Family
    HiSilicon Kirin left arrow HiSilicon Kirin
  • Generation
    4 left arrow 4
  • CPU group
    HiSilicon Kirin 650 left arrow HiSilicon Kirin 650
CPU Cores and Base Frequency

In this block we are going to compare HiSilicon Kirin 650 vs HiSilicon Kirin 655 by main technical specifications: number of cores and threads, base and maximum frequencies, process technology and cache size. The higher these specifications are, the more powerful your CPU will be.

  • Frequency
    1.70 GHz left arrow 1.70 GHz
  • CPU Cores
    8 left arrow 8
  • Turbo (1 Core)
    2.00 GHz left arrow 2.12 GHz
  • CPU Threads
    8 left arrow 8
  • Turbo (8 Cores)
    2.00 GHz left arrow 2.12 GHz
  • Hyperthreading
    No left arrow No
  • Overclocking
    No left arrow No
  • Core architecture
    hybrid (big.LITTLE) left arrow hybrid (big.LITTLE)
  • A core
    4x Cortex-A53 left arrow 4x Cortex-A53
  • B core
    4x Cortex-A53 left arrow 4x Cortex-A53
Internal Graphics

Common specifications for integrated graphics cards in HiSilicon Kirin 650 and HiSilicon Kirin 655 along with supported interfaces and connection options. This block has no effect on the final efficiency of the CPU.

  • GPU name
    ARM Mali-T830 MP2 left arrow ARM Mali-T830 MP2
  • GPU frequency
    0.90 GHz left arrow 0.90 GHz
  • GPU (Turbo)
    0.90 GHz left arrow 0.90 GHz
  • Execution units
    2 left arrow 2
  • Shader
    32 left arrow 32
  • Max. displays
    2 left arrow 2
  • Generation
    Midgard 4 left arrow Midgard 4
  • DirectX Version
    11 left arrow 11
  • Technology
    28nm left arrow 28nm
  • Release date
    Q4/2015 left arrow Q4/2015
Hardware codec support

Let's compare the support of video codecs between HiSilicon Kirin 650 and HiSilicon Kirin 655. Hardware support of video decoding by embedded graphics cards directly affects the speed and quality of rendering videos.

  • h265 / HEVC (8 bit)
    Decode / Encode left arrow Decode / Encode
  • h265 / HEVC (10 bit)
    Decode left arrow Decode
  • h264
    Decode / Encode left arrow Decode / Encode
  • VP9
    No left arrow No
  • VP8
    Decode / Encode left arrow Decode / Encode
  • AV1
    No left arrow No
  • AVC
    No left arrow No
  • VC-1
    No left arrow No
  • JPEG
    Decode / Encode left arrow Decode / Encode
Memory & PCIe

To choose the best model between HiSilicon Kirin 650 and HiSilicon Kirin 655 you need to pay special attention to memory type, clock frequency, multi-channel features, and PCIe version. The higher these numbers are, the better your CPU will be. Keep in mind that the maximum memory and frequency may also depend on the model of the motherboard.

  • Memory type
    LPDDR3-933 left arrow LPDDR3-933
  • ECC
    No left arrow No
  • Memory channels
    2 left arrow 2
Encryption

AES-NI encryption support for CPUs HiSilicon Kirin 650 and HiSilicon Kirin 655.

  • AES-NI
    No left arrow No
Thermal Management

Let's find out what TDP value would be better for HiSilicon Kirin 650 or HiSilicon Kirin 655? The Thermal Design Power (TDP) indicates the maximum amount of heat that should be dissipated by the chip cooling system. However, the value of TDP gives only a rough indication of the real power consumption of the CPU.

Technical details

Here you can find a comparison of 2nd and 3rd level cache sizes for HiSilicon Kirin 650 and HiSilicon Kirin 655 CPUs along with a list of ISA extensions.

  • Instruction set (ISA)
    ARMv8-A64 (64 bit) left arrow ARMv8-A64 (64 bit)
  • Virtualization
    None left arrow None
  • Architecture
    Cortex-A53 / Cortex-A53 left arrow Cortex-A53 / Cortex-A53
  • Technology
    16 nm left arrow 16 nm
  • Socket
    N/A left arrow N/A
  • Release date
    Q2/2016 left arrow Q2/2016
Devices using this processor

List of devices based on HiSilicon Kirin 650 and HiSilicon Kirin 655.

  • Used in
    Unknown left arrow Unknown
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