HiSilicon Kirin 970
Qualcomm Snapdragon 778G
Select video card 1
Select video card 2

HiSilicon Kirin 970 vs Qualcomm Snapdragon 778G

Overall score
star star star star star
Released
Q3/2017
Released
Q2/2021
Overall score
star star star star star

Which one of the central processing units is better: HiSilicon Kirin 970 or Qualcomm Snapdragon 778G? On this page we compare the technical data and benchmark results of different CPUs.

The HiSilicon Kirin 970 has 8 cores and 8 threads with maximum working frequency of 2.40 GHz. The HiSilicon Kirin 970 was released on Q3/2017.

The Qualcomm Snapdragon 778G has 8 cores with 8 threads and 2.40 GHz of frequency. The Qualcomm Snapdragon 778G was released on Q2/2021.

Differences
Reasons to consider
HiSilicon Kirin 970
Report a bug
Reasons to consider
Qualcomm Snapdragon 778G
Report a bug
  • Higher clock speed
    1.90 GHz left arrow 1.84 GHz
    Around 3% better clock speed
Specifications
Complete list of technical specifications
HiSilicon Kirin 970 HiSilicon Kirin 970
Qualcomm Snapdragon 778G Qualcomm Snapdragon 778G
CPU generation and family

Let's find out which one of HiSilicon Kirin 970 and Qualcomm Snapdragon 778G is of a more recent generation, and what segment it belongs to.

  • Name
    HiSilicon Kirin 970 left arrow Qualcomm Snapdragon 778G
  • Segment
    Mobile left arrow Mobile
  • Family
    HiSilicon Kirin left arrow Qualcomm Snapdragon
  • Generation
    6 left arrow 4
  • CPU group
    HiSilicon Kirin 970 left arrow Qualcomm Snapdragon 778
CPU Cores and Base Frequency

In this block we are going to compare HiSilicon Kirin 970 vs Qualcomm Snapdragon 778G by main technical specifications: number of cores and threads, base and maximum frequencies, process technology and cache size. The higher these specifications are, the more powerful your CPU will be.

  • Frequency
    1.84 GHz left arrow 1.90 GHz
  • CPU Cores
    8 left arrow 8
  • Turbo (1 Core)
    2.40 GHz left arrow 2.40 GHz
  • CPU Threads
    8 left arrow 8
  • Turbo (8 Cores)
    2.40 GHz left arrow 2.20 GHz
  • Hyperthreading
    No left arrow No
  • Overclocking
    No left arrow No
  • Core architecture
    hybrid (big.LITTLE) left arrow hybrid (Prime / big.LITTLE)
  • A core
    4x Cortex-A73 left arrow 1x Kryo 670 Prime
  • B core
    4x Cortex-A53 left arrow 3x Kryo 670 Gold
  • C core
    -- left arrow 4x Kryo 670 Silver
Internal Graphics

Common specifications for integrated graphics cards in HiSilicon Kirin 970 and Qualcomm Snapdragon 778G along with supported interfaces and connection options. This block has no effect on the final efficiency of the CPU.

  • GPU name
    ARM Mali-G72 MP12 left arrow Qualcomm Adreno 642L
  • GPU frequency
    0.75 GHz left arrow
  • GPU (Turbo)
    No turbo left arrow No turbo
  • Execution units
    12 left arrow 4
  • Shader
    192 left arrow 384
  • Max. GPU Memory
    2 GB left arrow 4 GB
  • Max. displays
    1 left arrow 1
  • Generation
    Bifrost 2 left arrow 5
  • DirectX Version
    12 left arrow 12.0
  • Technology
    16 nm left arrow 6 nm
  • Release date
    Q3/2017 left arrow Q2/2021
Hardware codec support

Let's compare the support of video codecs between HiSilicon Kirin 970 and Qualcomm Snapdragon 778G. Hardware support of video decoding by embedded graphics cards directly affects the speed and quality of rendering videos.

  • h265 / HEVC (8 bit)
    Decode / Encode left arrow Decode / Encode
  • h265 / HEVC (10 bit)
    Decode / Encode left arrow Decode / Encode
  • h264
    Decode / Encode left arrow Decode / Encode
  • VP9
    Decode / Encode left arrow Decode / Encode
  • VP8
    Decode / Encode left arrow Decode / Encode
  • AV1
    No left arrow No
  • AVC
    Decode / Encode left arrow Decode
  • VC-1
    Decode / Encode left arrow Decode
  • JPEG
    Decode / Encode left arrow Decode / Encode
Memory & PCIe

To choose the best model between HiSilicon Kirin 970 and Qualcomm Snapdragon 778G you need to pay special attention to memory type, clock frequency, multi-channel features, and PCIe version. The higher these numbers are, the better your CPU will be. Keep in mind that the maximum memory and frequency may also depend on the model of the motherboard.

  • Memory type
    LPDDR4X-2133 left arrow LPDDR4X-2133
  • Max. Memory
    8 GB left arrow 16 GB
  • ECC
    No left arrow No
  • Memory channels
    4 left arrow 2
Encryption

AES-NI encryption support for CPUs HiSilicon Kirin 970 and Qualcomm Snapdragon 778G.

  • AES-NI
    No left arrow No
Thermal Management

Let's find out what TDP value would be better for HiSilicon Kirin 970 or Qualcomm Snapdragon 778G? The Thermal Design Power (TDP) indicates the maximum amount of heat that should be dissipated by the chip cooling system. However, the value of TDP gives only a rough indication of the real power consumption of the CPU.

  • TDP (PL1)
    9 W left arrow
Technical details

Here you can find a comparison of 2nd and 3rd level cache sizes for HiSilicon Kirin 970 and Qualcomm Snapdragon 778G CPUs along with a list of ISA extensions.

  • Instruction set (ISA)
    ARMv8-A64 (64 bit) left arrow ARMv8-A64 (64 bit)
  • Virtualization
    None left arrow None
  • L3-Cache
    2.00 MB left arrow 2.00 MB
  • Architecture
    Cortex-A73 / Cortex-A53 left arrow Kryo 670
  • Technology
    10 nm left arrow 6 nm
  • Socket
    N/A left arrow N/A
  • Release date
    Q3/2017 left arrow Q2/2021
  • Part Number
    -- left arrow SM7325
Devices using this processor

List of devices based on HiSilicon Kirin 970 and Qualcomm Snapdragon 778G.

  • Used in
    Huawei Honor 10Huawei Note 10Huawei PlayHuawei Honor View 10Huawei Mate 10 ProHuawei P20Huawei Nova 3Huawei Nova 4 left arrow Unknown
Latest comparisons