HiSilicon Kirin 955
Qualcomm Snapdragon 888
Select video card 1
Select video card 2

HiSilicon Kirin 955 vs Qualcomm Snapdragon 888

Overall score
star star star star star
Released
Q2/2016
Released
Q1/2021
Overall score
star star star star star

Which one of the central processing units is better: HiSilicon Kirin 955 or Qualcomm Snapdragon 888? On this page we compare the technical data and benchmark results of different CPUs.

The HiSilicon Kirin 955 has 8 cores and 8 threads with maximum working frequency of 2.50 GHz. The HiSilicon Kirin 955 was released on Q2/2016.

The Qualcomm Snapdragon 888 has 8 cores with 8 threads and 2.50 GHz of frequency. The Qualcomm Snapdragon 888 was released on Q1/2021.

Differences
Reasons to consider
HiSilicon Kirin 955
Report a bug
Reasons to consider
Qualcomm Snapdragon 888
Report a bug
  • Higher turbo clock speed
    2.84 GHz left arrow 2.50 GHz
    Around 12 % better overclocked clock speed
Specifications
Complete list of technical specifications
HiSilicon Kirin 955 HiSilicon Kirin 955
Qualcomm Snapdragon 888 Qualcomm Snapdragon 888
CPU generation and family

Let's find out which one of HiSilicon Kirin 955 and Qualcomm Snapdragon 888 is of a more recent generation, and what segment it belongs to.

  • Name
    HiSilicon Kirin 955 left arrow Qualcomm Snapdragon 888
  • Segment
    Mobile left arrow Mobile
  • Family
    HiSilicon Kirin left arrow Qualcomm Snapdragon
  • Generation
    4 left arrow 8
  • CPU group
    HiSilicon Kirin 950 left arrow Qualcomm Snapdragon 888
CPU Cores and Base Frequency

In this block we are going to compare HiSilicon Kirin 955 vs Qualcomm Snapdragon 888 by main technical specifications: number of cores and threads, base and maximum frequencies, process technology and cache size. The higher these specifications are, the more powerful your CPU will be.

  • Frequency
    1.80 GHz left arrow 1.80 GHz
  • CPU Cores
    8 left arrow 8
  • Turbo (1 Core)
    2.50 GHz left arrow 2.84 GHz
  • CPU Threads
    8 left arrow 8
  • Turbo (8 Cores)
    2.50 GHz left arrow 2.40 GHz
  • Hyperthreading
    No left arrow No
  • Overclocking
    No left arrow No
  • Core architecture
    hybrid (big.LITTLE) left arrow hybrid (Prime / big.LITTLE)
  • A core
    4x Cortex-A72 left arrow 1x Kryo 680 Prime
  • B core
    4x Cortex-A53 left arrow 3x Kryo 680 Gold
  • C core
    -- left arrow 4x Kryo 680 Silver
Internal Graphics

Common specifications for integrated graphics cards in HiSilicon Kirin 955 and Qualcomm Snapdragon 888 along with supported interfaces and connection options. This block has no effect on the final efficiency of the CPU.

  • GPU name
    ARM Mali-T880 MP4 left arrow Qualcomm Adreno 660
  • GPU frequency
    0.90 GHz left arrow 0.84 GHz
  • GPU (Turbo)
    0.90 GHz left arrow No turbo
  • Execution units
    4 left arrow 0
  • Shader
    64 left arrow 0
  • Max. displays
    2 left arrow 0
  • Generation
    Midgard 4 left arrow 6
  • DirectX Version
    11 left arrow 12.1
  • Technology
    16 nm left arrow 5 nm
  • Release date
    Q2/2016 left arrow Q1/2021
Hardware codec support

Let's compare the support of video codecs between HiSilicon Kirin 955 and Qualcomm Snapdragon 888. Hardware support of video decoding by embedded graphics cards directly affects the speed and quality of rendering videos.

  • h265 / HEVC (8 bit)
    Decode / Encode left arrow Decode / Encode
  • h265 / HEVC (10 bit)
    Decode left arrow Decode / Encode
  • h264
    Decode / Encode left arrow Decode / Encode
  • VP9
    No left arrow Decode / Encode
  • VP8
    Decode / Encode left arrow Decode / Encode
  • AV1
    No left arrow No
  • AVC
    No left arrow Decode
  • VC-1
    No left arrow Decode
  • JPEG
    Decode / Encode left arrow Decode / Encode
Memory & PCIe

To choose the best model between HiSilicon Kirin 955 and Qualcomm Snapdragon 888 you need to pay special attention to memory type, clock frequency, multi-channel features, and PCIe version. The higher these numbers are, the better your CPU will be. Keep in mind that the maximum memory and frequency may also depend on the model of the motherboard.

  • Memory type
    LPDDR3LPDDR4 left arrow LPDDR4X-4266LPDDR5-3200
  • ECC
    No left arrow No
  • Memory channels
    2 left arrow 4
Encryption

AES-NI encryption support for CPUs HiSilicon Kirin 955 and Qualcomm Snapdragon 888.

  • AES-NI
    No left arrow No
Thermal Management

Let's find out what TDP value would be better for HiSilicon Kirin 955 or Qualcomm Snapdragon 888? The Thermal Design Power (TDP) indicates the maximum amount of heat that should be dissipated by the chip cooling system. However, the value of TDP gives only a rough indication of the real power consumption of the CPU.

Technical details

Here you can find a comparison of 2nd and 3rd level cache sizes for HiSilicon Kirin 955 and Qualcomm Snapdragon 888 CPUs along with a list of ISA extensions.

  • Instruction set (ISA)
    ARMv8-A64 (64 bit) left arrow ARMv8-A64 (64 bit)
  • Virtualization
    None left arrow None
  • L2-Cache
    -- left arrow 1.00 MB
  • L3-Cache
    -- left arrow 8.00 MB
  • Architecture
    Cortex-A72 / Cortex-A53 left arrow Kryo 680
  • Technology
    16 nm left arrow 5 nm
  • Socket
    N/A left arrow N/A
  • Release date
    Q2/2016 left arrow Q1/2021
Devices using this processor

List of devices based on HiSilicon Kirin 955 and Qualcomm Snapdragon 888.

  • Used in
    Unknown left arrow Unknown
Latest comparisons