HiSilicon Kirin 9000E
Qualcomm Snapdragon 845
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HiSilicon Kirin 9000E vs Qualcomm Snapdragon 845

Overall score
star star star star star
Released
Q4/2020
Released
Q1/2018
Overall score
star star star star star

Which one of the central processing units is better: HiSilicon Kirin 9000E or Qualcomm Snapdragon 845? On this page we compare the technical data and benchmark results of different CPUs.

The HiSilicon Kirin 9000E has 8 cores and 8 threads with maximum working frequency of 3.13 GHz. The HiSilicon Kirin 9000E was released on Q4/2020.

The Qualcomm Snapdragon 845 has 8 cores with 8 threads and 3.13 GHz of frequency. The Qualcomm Snapdragon 845 was released on Q1/2018.

Differences
Reasons to consider
HiSilicon Kirin 9000E
Report a bug
  • Higher clock speed
    2.04 GHz left arrow 1.80 GHz
    Around -13% better clock speed
  • Higher turbo clock speed
    3.13 GHz left arrow 2.80 GHz
    Around 11% better overclocked clock speed
Reasons to consider
Qualcomm Snapdragon 845
Report a bug
Specifications
Complete list of technical specifications
HiSilicon Kirin 9000E HiSilicon Kirin 9000E
Qualcomm Snapdragon 845 Qualcomm Snapdragon 845
CPU generation and family

Let's find out which one of HiSilicon Kirin 9000E and Qualcomm Snapdragon 845 is of a more recent generation, and what segment it belongs to.

  • Name
    HiSilicon Kirin 9000E left arrow Qualcomm Snapdragon 845
  • Segment
    Mobile left arrow Mobile
  • Family
    HiSilicon Kirin left arrow Qualcomm Snapdragon
  • Generation
    9 left arrow 5
  • CPU group
    HiSilicon Kirin 9000 left arrow Qualcomm Snapdragon 845
CPU Cores and Base Frequency

In this block we are going to compare HiSilicon Kirin 9000E vs Qualcomm Snapdragon 845 by main technical specifications: number of cores and threads, base and maximum frequencies, process technology and cache size. The higher these specifications are, the more powerful your CPU will be.

  • Frequency
    2.04 GHz left arrow 1.80 GHz
  • CPU Cores
    8 left arrow 8
  • Turbo (1 Core)
    3.13 GHz left arrow 2.80 GHz
  • CPU Threads
    8 left arrow 8
  • Turbo (8 Cores)
    2.54 GHz left arrow 2.80 GHz
  • Hyperthreading
    No left arrow No
  • Overclocking
    No left arrow No
  • Core architecture
    hybrid (Prime / big.LITTLE) left arrow hybrid (big.LITTLE)
  • A core
    1x Cortex-A77 left arrow 4x Kryo 385 Gold
  • B core
    3x Cortex-A77 left arrow 4x Kryo 385 Silver
  • C core
    4x Cortex-A55 left arrow --
Internal Graphics

Common specifications for integrated graphics cards in HiSilicon Kirin 9000E and Qualcomm Snapdragon 845 along with supported interfaces and connection options. This block has no effect on the final efficiency of the CPU.

  • GPU name
    ARM Mali-G78 MP22 left arrow Qualcomm Adreno 630
  • GPU frequency
    0.76 GHz left arrow 0.70 GHz
  • GPU (Turbo)
    No turbo left arrow No turbo
  • Execution units
    22 left arrow 0
  • Shader
    352 left arrow 256
  • Max. GPU Memory
    -- left arrow 8 GB
  • Max. displays
    1 left arrow 2
  • Generation
    Vallhall 2 left arrow 4
  • DirectX Version
    12 left arrow 11
  • Technology
    5 nm left arrow 10 nm
  • Release date
    Q4/2020 left arrow Q1/2018
Hardware codec support

Let's compare the support of video codecs between HiSilicon Kirin 9000E and Qualcomm Snapdragon 845. Hardware support of video decoding by embedded graphics cards directly affects the speed and quality of rendering videos.

  • h265 / HEVC (8 bit)
    Decode / Encode left arrow Decode
  • h265 / HEVC (10 bit)
    Decode / Encode left arrow Decode
  • h264
    Decode / Encode left arrow Decode / Encode
  • VP9
    Decode / Encode left arrow Decode
  • VP8
    Decode / Encode left arrow Decode
  • AV1
    Decode left arrow No
  • AVC
    Decode / Encode left arrow Decode
  • VC-1
    Decode / Encode left arrow Decode
  • JPEG
    Decode / Encode left arrow Decode / Encode
Memory & PCIe

To choose the best model between HiSilicon Kirin 9000E and Qualcomm Snapdragon 845 you need to pay special attention to memory type, clock frequency, multi-channel features, and PCIe version. The higher these numbers are, the better your CPU will be. Keep in mind that the maximum memory and frequency may also depend on the model of the motherboard.

  • Memory type
    LPDDR4X-2133LPDDR5-2750 left arrow LPDDR4X-1866
  • Max. Memory
    left arrow 8 GB
  • ECC
    No left arrow No
  • Memory channels
    4 left arrow 4
Encryption

AES-NI encryption support for CPUs HiSilicon Kirin 9000E and Qualcomm Snapdragon 845.

  • AES-NI
    No left arrow No
Thermal Management

Let's find out what TDP value would be better for HiSilicon Kirin 9000E or Qualcomm Snapdragon 845? The Thermal Design Power (TDP) indicates the maximum amount of heat that should be dissipated by the chip cooling system. However, the value of TDP gives only a rough indication of the real power consumption of the CPU.

Technical details

Here you can find a comparison of 2nd and 3rd level cache sizes for HiSilicon Kirin 9000E and Qualcomm Snapdragon 845 CPUs along with a list of ISA extensions.

  • Instruction set (ISA)
    ARMv8-A64 (64 bit) left arrow ARMv8-A64 (64 bit)
  • Virtualization
    None left arrow None
  • L2-Cache
    -- left arrow 0.51 MB
  • L3-Cache
    -- left arrow 2.00 MB
  • Architecture
    Cortex-A77 / Cortex-A55 left arrow Kryo 385
  • Technology
    5 nm left arrow 10 nm
  • Socket
    N/A left arrow N/A
  • Release date
    Q4/2020 left arrow Q1/2018
  • Part Number
    -- left arrow SDM845
Devices using this processor

List of devices based on HiSilicon Kirin 9000E and Qualcomm Snapdragon 845.

  • Used in
    Unknown left arrow OnePlus 6OnePlus 6TVivo NEX SAsus Zenfone 5zRazer Phone 2Asus ROG PhoneSony Xperia XZ2
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