HiSilicon Kirin 659 vs Qualcomm Snapdragon 808

Let's find out which one of HiSilicon Kirin 659 and Qualcomm Snapdragon 808 is of a more recent generation, and what segment it belongs to.

• Name
  HiSilicon Kirin 659 Qualcomm Snapdragon 808
• Segment
  Mobile Mobile
• Family
  HiSilicon Kirin Qualcomm Snapdragon
• Generation
  4 2
• CPU group
  HiSilicon Kirin 650 Qualcomm Snapdragon 808/810

In this block we are going to compare HiSilicon Kirin 659 vs Qualcomm Snapdragon 808 by main technical specifications: number of cores and threads, base and maximum frequencies, process technology and cache size. The higher these specifications are, the more powerful your CPU will be.

• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)

Common specifications for integrated graphics cards in HiSilicon Kirin 659 and Qualcomm Snapdragon 808 along with supported interfaces and connection options. This block has no effect on the final efficiency of the CPU.

• GPU name
  ARM Mali-T830 MP2 Qualcomm Adreno 418
• GPU frequency
  0.90 GHz 0.60 GHz
• GPU (Turbo)
  0.90 GHz 0.60 GHz
• Execution units
  2 0
• Shader
  32 128
• Max. displays
  2 0
• Generation
  Midgard 4 4
• Technology
  28nm 20 nm
• Release date
  Q4/2015 Q2/2014

Let's compare the support of video codecs between HiSilicon Kirin 659 and Qualcomm Snapdragon 808. Hardware support of video decoding by embedded graphics cards directly affects the speed and quality of rendering videos.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode No
• h264
  Decode / Encode Decode / Encode
• VP9
  No No
• VP8
  Decode / Encode No
• AV1
  No No
• AVC
  No No
• VC-1
  No Decode
• JPEG
  Decode / Encode Decode / Encode

To choose the best model between HiSilicon Kirin 659 and Qualcomm Snapdragon 808 you need to pay special attention to memory type, clock frequency, multi-channel features, and PCIe version. The higher these numbers are, the better your CPU will be. Keep in mind that the maximum memory and frequency may also depend on the model of the motherboard.

• Memory type
  LPDDR3-933 LPDDR3-933
• ECC
  No No
• Memory channels
  2 2 (Dual Channel)

Let's find out what TDP value would be better for HiSilicon Kirin 659 or Qualcomm Snapdragon 808? The Thermal Design Power (TDP) indicates the maximum amount of heat that should be dissipated by the chip cooling system. However, the value of TDP gives only a rough indication of the real power consumption of the CPU.

Here you can find a comparison of 2nd and 3rd level cache sizes for HiSilicon Kirin 659 and Qualcomm Snapdragon 808 CPUs along with a list of ISA extensions.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• Architecture
  Cortex-A53 / Cortex-A53 Cortex-A57 / Cortex-A53
• Technology
  16 nm 20 nm
• Socket
  N/A N/A
• Release date
  Q2/2016 Q3/2014
• Part Number
  -- MSM8992