Qualcomm Snapdragon 855 Plus
HiSilicon Kirin 990 5G
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HiSilicon Kirin 990 5G vs Qualcomm Snapdragon 855 Plus

Overall score
star star star star star
Released
Q4/2018
Released
Q3/2019
Overall score
star star star star star

Which one of the central processing units is better: HiSilicon Kirin 990 5G or Qualcomm Snapdragon 855 Plus? On this page we compare the technical data and benchmark results of different CPUs.

The HiSilicon Kirin 990 5G has 8 cores and 8 threads with maximum working frequency of 2.36 GHz. The HiSilicon Kirin 990 5G was released on Q3/2019.

The Qualcomm Snapdragon 855 Plus has cores with 8 threads and 2.36 GHz of frequency. The Qualcomm Snapdragon 855 Plus was released on Q4/2018.

Differences
Reasons to consider
Qualcomm Snapdragon 855 Plus
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Reasons to consider
HiSilicon Kirin 990 5G
Report a bug
Specifications
Complete list of technical specifications
Qualcomm Snapdragon 855 Plus Qualcomm Snapdragon 855 Plus
HiSilicon Kirin 990 5G HiSilicon Kirin 990 5G
CPU generation and family

Let's find out which one of Qualcomm Snapdragon 855 Plus and HiSilicon Kirin 990 5G is of a more recent generation, and what segment it belongs to.

  • Name
    Qualcomm Snapdragon 855 Plus left arrow HiSilicon Kirin 990 5G
  • Family
    Qualcomm Snapdragon left arrow HiSilicon Kirin
  • CPU group
    Qualcomm Snapdragon 855/860 left arrow HiSilicon Kirin 990
  • Segment
    Mobile left arrow Mobile
  • Generation
    6 left arrow 8
  • Successor
    Qualcomm Snapdragon 860 left arrow --
CPU Cores and Base Frequency

In this block we are going to compare Qualcomm Snapdragon 855 Plus vs HiSilicon Kirin 990 5G by main technical specifications: number of cores and threads, base and maximum frequencies, process technology and cache size. The higher these specifications are, the more powerful your CPU will be.

  • Core architecture
    hybrid (Prime / big.LITTLE) left arrow hybrid (Prime / big.LITTLE)
  • Overclocking
    No left arrow No
Internal Graphics

Common specifications for integrated graphics cards in Qualcomm Snapdragon 855 Plus and HiSilicon Kirin 990 5G along with supported interfaces and connection options. This block has no effect on the final efficiency of the CPU.

  • GPU name
    Qualcomm Adreno 640 left arrow ARM Mali-G76 MP16
  • GPU frequency
    0.25 GHz left arrow 0.60 GHz
  • GPU (Turbo)
    0.68 GHz left arrow No turbo
  • Execution units
    4 left arrow 16
  • Shader
    384 left arrow 256
  • Max. GPU Memory
    4 GB left arrow 4 GB
  • Max. displays
    1 left arrow 2
  • Generation
    5 left arrow Bifrost 3
  • Technology
    7 nm left arrow 7 nm
  • Release date
    Q1/2019 left arrow Q3/2018
Hardware codec support

Let's compare the support of video codecs between Qualcomm Snapdragon 855 Plus and HiSilicon Kirin 990 5G. Hardware support of video decoding by embedded graphics cards directly affects the speed and quality of rendering videos.

  • h265 / HEVC (8 bit)
    Decode / Encode left arrow Decode / Encode
  • h265 / HEVC (10 bit)
    Decode / Encode left arrow Decode / Encode
  • h264
    Decode / Encode left arrow Decode / Encode
  • VP8
    Decode / Encode left arrow Decode / Encode
  • VP9
    Decode / Encode left arrow Decode / Encode
  • AV1
    No left arrow No
  • AVC
    No left arrow Decode / Encode
  • VC-1
    No left arrow Decode / Encode
  • JPEG
    No left arrow Decode / Encode
Memory & PCIe

To choose the best model between Qualcomm Snapdragon 855 Plus and HiSilicon Kirin 990 5G you need to pay special attention to memory type, clock frequency, multi-channel features, and PCIe version. The higher these numbers are, the better your CPU will be. Keep in mind that the maximum memory and frequency may also depend on the model of the motherboard.

  • Memory type
    LPDDR4X-4266 left arrow LPDDR4X-4266
  • Max. Memory
    16 GB left arrow 8 GB
  • Memory channels
    4 (Quad Channel) left arrow 4
  • ECC
    No left arrow No
Thermal Management

Let's find out what TDP value would be better for Qualcomm Snapdragon 855 Plus or HiSilicon Kirin 990 5G? The Thermal Design Power (TDP) indicates the maximum amount of heat that should be dissipated by the chip cooling system. However, the value of TDP gives only a rough indication of the real power consumption of the CPU.

  • TDP (PL1)
    left arrow 6 W
Technical details

Here you can find a comparison of 2nd and 3rd level cache sizes for Qualcomm Snapdragon 855 Plus and HiSilicon Kirin 990 5G CPUs along with a list of ISA extensions.

  • Technology
    7 nm left arrow 7 nm
  • Socket
    N/A left arrow N/A
  • L2-Cache
    2.00 MB left arrow --
  • L3-Cache
    3.00 MB left arrow 2.00 MB
  • Architecture
    Kryo 485 left arrow Cortex-A76 / Cortex-A55
  • Virtualization
    None left arrow None
  • Instruction set (ISA)
    ARMv8-A64 (64 bit) left arrow ARMv8-A64 (64 bit)
  • Release date
    Q4/2018 left arrow Q3/2019
  • Part Number
    SM8150-AC left arrow --
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