HiSilicon Kirin 658 vs Qualcomm Snapdragon 617

Let's find out which one of Qualcomm Snapdragon 617 and HiSilicon Kirin 658 is of a more recent generation, and what segment it belongs to.

• Name
  Qualcomm Snapdragon 617 HiSilicon Kirin 658
• Family
  Qualcomm Snapdragon HiSilicon Kirin
• CPU group
  Qualcomm Snapdragon 610 HiSilicon Kirin 650
• Segment
  Mobile Mobile
• Generation
  2 4

In this block we are going to compare Qualcomm Snapdragon 617 vs HiSilicon Kirin 658 by main technical specifications: number of cores and threads, base and maximum frequencies, process technology and cache size. The higher these specifications are, the more powerful your CPU will be.

• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Overclocking
  No No

Common specifications for integrated graphics cards in Qualcomm Snapdragon 617 and HiSilicon Kirin 658 along with supported interfaces and connection options. This block has no effect on the final efficiency of the CPU.

• GPU name
  Qualcomm Adreno 405 ARM Mali-T830 MP2
• GPU frequency
  0.55 GHz 0.90 GHz
• GPU (Turbo)
  0.55 GHz 0.90 GHz
• Execution units
  0 2
• Shader
  48 32
• Max. displays
  0 2
• Generation
  4 Midgard 4
• Technology
  28 nm 28nm
• Release date
  Q1/2014 Q4/2015

Let's compare the support of video codecs between Qualcomm Snapdragon 617 and HiSilicon Kirin 658. Hardware support of video decoding by embedded graphics cards directly affects the speed and quality of rendering videos.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  No Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  No Decode / Encode
• VP9
  No No
• AV1
  No No
• AVC
  No No
• VC-1
  Decode No
• JPEG
  Decode / Encode Decode / Encode

To choose the best model between Qualcomm Snapdragon 617 and HiSilicon Kirin 658 you need to pay special attention to memory type, clock frequency, multi-channel features, and PCIe version. The higher these numbers are, the better your CPU will be. Keep in mind that the maximum memory and frequency may also depend on the model of the motherboard.

• Memory type
  LPDDR3-933 LPDDR3-933
• Memory channels
  1 (Single Channel) 2
• ECC
  No No

Let's find out what TDP value would be better for Qualcomm Snapdragon 617 or HiSilicon Kirin 658? The Thermal Design Power (TDP) indicates the maximum amount of heat that should be dissipated by the chip cooling system. However, the value of TDP gives only a rough indication of the real power consumption of the CPU.

Here you can find a comparison of 2nd and 3rd level cache sizes for Qualcomm Snapdragon 617 and HiSilicon Kirin 658 CPUs along with a list of ISA extensions.

• Technology
  28 nm 16 nm
• Socket
  N/A N/A
• Architecture
  Cortex-A53 Cortex-A53 / Cortex-A53
• Virtualization
  None None
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Release date
  Q4/2015 Q2/2016
• Part Number
  MSM8952 --